2528 Qume Dr Suite 4 California, 95131 United States
Company Details
About The Company
HillTron Corporation offers both lead-free & leaded soldering options on PCB assembly flex circuit assembly rigid flex assembly and wafer substrate assembly. Alloy used for lead-free solder is tin-silver-copper (Sn95/Ag3.5/Cu0.7) with a melting range of 217-220 deg C. We assemble or re-work BGA Micro-BGA CSP QFN SON and similar packages. We have re-worked BGAs with 1400 pins & heat sinks on it.
