Component Handling Inspection Packaging Services Inc. specializes in providing wafer to die processing services. We also offer wafer thinning wafer sawing bare die pick & place bumped dies and visual inspection services. We can handle all the sawing and cutting needs of silicon bumped silicon glass quartz and composite material wafers. Single pass or progressive cutting can be used to perform either saw-through or custom sawing at various depths. Coolant is supplied from our in-house de-ionized water system. All incoming wafers are inspected prior to processing. Our wafer thinning process induces less stress in the wafer. Our semi-automatic inspection system combines high-resolution video with optics and a computer controlled micro-stepping linear motion table. Our enhanced automatic pick and place systems are able to pick up to 8 inch wafers with uninked die according to a software probe map. These systems have dual alignment capability which permits the use of edge pick-up collets.
